000			02157nam a22002897a 4500
005			20090907095141.0
008			090907t xxu||||| |||| 00| 0 eng d
080			_a621.38(05) _bIEE
110			_aInstitute of electrical and electronics engineers, Inc. _93751
245			_aProceedings of the IEEE
260			_aNew York _bInstitute of electrical and electronics engineers, Inc. _c1913 _93782
490			_vvol.1, no.1
500			_aLib. has v.69 (1981)-v.70 (1982), v.72 (1984)-v.73 (1985), v.76 (1988)-v78(1990)
942			_cBV
952			_w2009-10-09 _p00038317 _r2009-10-09 _40 _00 _bUL _10 _o621.38(05) IEE.78/2 _d2009-10-09 _70 _2udc _yBV _aUL
952			_w2009-10-09 _p00038316 _r2009-10-09 _40 _00 _bUL _10 _o621.38(05) IEE.78/1 _d2009-10-09 _70 _2udc _yBV _aUL
952			_w2009-10-09 _p00038315 _r2009-10-09 _40 _00 _bUL _10 _o621.38(05) IEE.77/2 _d2009-10-09 _70 _2udc _yBV _aUL
952			_w2009-10-09 _p00038314 _r2009-10-09 _40 _00 _bUL _10 _o621.38(05) IEE.77/1 _d2009-10-09 _70 _2udc _yBV _aUL
952			_w2009-09-07 _p00036107 _r2009-09-07 _40 _00 _bUL _10 _o621.38(05) IEE.76 _d2009-09-07 _70 _cREF _2udc _yBV _aUL
952			_w2009-09-07 _p00032192 _r2009-09-07 _40 _00 _bUL _10 _o621.38(05) IEE.73/2 _d2009-09-07 _70 _cREF _2udc _yBV _aUL
952			_w2009-09-07 _p00032191 _r2009-09-07 _40 _00 _bUL _10 _o621.38(05) IEE.73/1 _d2009-09-07 _70 _cREF _2udc _yBV _aUL
952			_w2009-09-07 _p00032190 _r2009-09-07 _40 _00 _bUL _10 _o621.38(05) IEE.72/2 _d2009-09-07 _70 _cREF _2udc _yBV _aUL
952			_w2009-09-07 _p00032189 _r2009-09-07 _40 _00 _bUL _10 _o621.38(05) IEE.72/1 _d2009-09-07 _70 _cREF _2udc _yBV _aUL
952			_w2009-09-07 _p00028617 _r2009-09-07 _40 _00 _bUL _10 _o621.38(05) IEE.70 _d2009-09-07 _70 _cREF _2udc _yBV _aUL
952			_w2009-09-07 _p00028616 _r2009-09-07 _40 _00 _bUL _10 _o621.38(05) IEE.69/2 _d2009-09-07 _70 _cREF _2udc _yBV _aUL
952			_w2009-09-07 _p00028615 _r2009-09-07 _40 _00 _bUL _10 _o621.38(05) IEE.69/1 _d2009-09-07 _70 _cREF _2udc _yBV _aUL
999			_c3292 _d3292