Lead-free soldering in electronics: science, technology and environmental impact

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Publication details: New York Marcel Dekker 2004Edition: Description: x, 342pISBN:

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Item type	Current library	Call number	Status	Date due	Barcode
Books	University Library	621.721.35:621.38 SUG (Browse shelf(Opens below))	Available		00055869

Previous		No cover image available	No cover image available		No cover image available	No cover image available	No cover image available	Next
Previous	621.71.9 KOT Nanoparticle assemblies and super structures	621.71.9 MIC R Micro and nano fabrication technology	621-72 WAL Modern developments in lubrication mechanics	621.721.35:621.38 SUG Lead-free soldering in electronics: science, technology and environmental impact	621.73.04 RAN TM Influence of Forging Pressure on the Mechanical Propertieson the Mechanical Properties of LM-4 at sub- solidus Tempreture	621.735 TRE Welding Manual for Enginnering Steel Forgines	621.735(02) UNT Forging Design Handbook	Next

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